The Film Laser Cutting system handles multiple processes of cutting, peeling, and cleaning of a film or sheet. With two types of laser, it processes full-cutting to cut films and half-cutting to cut only upper layers from the multiple layers of films with CO2 laser and higher accuracy cutting process with UV laser. Available for large-size substrates, this system can meet the mass-production needs.
It is used to manufacture flexible OLED displays.
Process | Laser cut (Full/Half/Pad cuts) Peeling Plasma cleaning Visual inspection |
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Laser type | CO2 Laser, UV Laser |
Cutting accuracy | ≤ ± 50 µm |
*YIELDEdGE: Japanese Trademark Registration number 6576710